SemiconductorWe are a well-established global player and solutions provider of advanced technologies in the semiconductor industry. Through long-term partnerships with the market leaders in machine building and with influential entities such as SEMI, we have acquired the necessary knowledge and know-how to become a leading player for equipping these machines with products that include sensors, PLCs and servo-drives and safety components.
Die / Wire Bonding
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Diced chips are connected to lead frames at a die-bonding machine, and then the frames and chips are connected with extremely fine gold wire at a wire bonding machine. Various chips are assembled accurately and quickly in these processes, which causes frequent switching between systems. To maintain high productivity and throughput of the machines, minimizing down-time and saving switching time would be key.
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